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Rogers 60mil 1.524mm RO4003C Double Sided RF PCB for WLAN

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers 60mil 1.524mm RO4003C Double Sided RF PCB for WLAN

Rogers 60mil 1.524mm RO4003C  Double Sided RF PCB for WLAN
Rogers 60mil 1.524mm RO4003C  Double Sided RF PCB for WLAN Rogers 60mil 1.524mm RO4003C  Double Sided RF PCB for WLAN Rogers 60mil 1.524mm RO4003C  Double Sided RF PCB for WLAN Rogers 60mil 1.524mm RO4003C  Double Sided RF PCB for WLAN

Large Image :  Rogers 60mil 1.524mm RO4003C Double Sided RF PCB for WLAN

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-005.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Rogers 4300C PCB Size: 84 X 78mm=1PCS
Copper Weight: 1oz Surface Finish: Electroless Nickel Over Immersion Gold
Layer Count: 2 Layer PCBthickness: 1.6mm
High Light:

60mil Ceramic PCB Board

,

1.524mm Ceramic PCB Board

 

Rogers 4003 60mil 1.524mm Circuit Board RO4003C High Frequency PCB Double Sided RF PCB for WLAN

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4003C material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4003C material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.

 

Rogers 60mil 1.524mm RO4003C  Double Sided RF PCB for WLAN 0

 

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

 

PCB Specifications

PCB SIZE 84 x 78mm=1PCS
BOARD TYPE RF PCB, Microwave PCB
Number of Layers Double sided PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1oz)+PLATE
RO4003C 60mil
copper ------- 35um(1oz)+PLATE
TECHNOLOGY  
Minimum Trace and Space: 10mil/12mil
Minimum / Maximum Holes: 0.3/2.3mm
Number of Different Holes: 4
Number of Drill Holes: 155
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL  
Glass Epoxy: RO4003C 60mil, Tg 288
Final foil external: 1.5oz
Final foil internal: 0oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING  
Surface Finish Electroless nickel over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To: no Solder mask reqruied
Solder Mask Color: no solder mask required
Solder Mask Type: no solder mask reqruied
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend no silkscreen required
Colour of Component Legend no silkscreen required
Manufacturer Name or Logo: no silkscreen required
VIA Plated Through Hole(PTH)
FLAMIBILITY RATING N/A
DIMENSION TOLERANCE  
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Typical applications are as follows:

Automotive Radar and Sensors

Cellular Base Station Antennas

Direct Broadcast Satellites

Low Noise Block

Power amplifiers

RFID

 

Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150 IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/ -55to288 IPC-TM-650 2.4.41
Tg >280   TMA A IPC-TM-650 2.4.24.3
Td 425   TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80 ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density 1.79   gm/cm3 23 ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        

 

Rogers 60mil 1.524mm RO4003C  Double Sided RF PCB for WLAN 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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