On June 8th, 2023, Zhongjing Electronics and Guangdong Yina Technology Co., Ltd. signed a cooperation and development agreement at the Tonghu Ecological Smart Innovation Park in Zhongkai High-tech Zone, Huizhou, Guangdong. The two companies will jointly develop and verify the application of new materials and new processes for "Advanced Energy Electronic Information Carrying Plate Hole Metalization Nano-conductive Technology". Zheng Zhihui, the Chief Economist of Huizhou Zhongkai High-tech Zone, Wen Bo, Deputy Director of the Science and Technology Innovation Bureau of Zhongkai High-tech Zone, Wang Jianxing, General Manager of Yina Technology, and Yu Xiangbin, Vice President of Zhongjing Electronics, attended the signing ceremony.

This technology cooperation will fully leverage the technological advantages and industry resources of both parties in their respective professional fields, to achieve innovation and alternative applications of graphene nano-materials in the key processes of printed circuit board (PCB). The hole metalization technology achieved through graphene nano-materials has many excellent performance characteristics, such as shortening the production cycle, improving the performance and quality of the film layer, reducing the production cost of PCB manufacturers, reducing environmental emissions, and promoting the innovation application of new materials and technologies in the PCB industry, as well as the import substitution of core materials.

Zhongjing Electronics and Guangdong Yina Technology respectively possess leading technological advantages in the PCB and graphene nano-material fields, and have strong complementarity in the industrial application of this innovative technology. This provides a solid foundation for the two parties to further develop technology in multiple forms and levels, as well as project and equity cooperation. The two parties will form a research and development joint team, accelerate the project development progress, promote the transformation of scientific and technological achievements into real productivity, and realize industrial application as soon as possible, promoting a significant innovation of new materials and new technologies in the PCB industry.