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Today, we’re going to introduce high frequency PCB built on RO4003C laminates.
RO4003C high frequency materials are woven glass reinforced hydrocarbon ceramic-filled laminates produced by Rogers Corporation. It has the similar electrical properties of PTFE/woven glass and manufacturability of epoxy resin materials.
RO4003C materials are designed to offer superior high frequency performance, with dielectric constant of 3.38 +/- 0.05, dissipation factor of 0.0027 at 10 GHz.
Low loss results in excellent electrical performance and allows applications with high operating frequencies.
RO4003C material possesses the stable electrical properties needed by designers of RF microwave circuits, matching networks and controlled impedance transmission lines.
The coefficient of thermal expansion (CTE) of RO4003C material (11 and 14 ppm/°C on X and Y axis) is similar to that of copper (17 ppm/°C) which allows the material to exhibit excellent dimensional stability, a property that needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of 46 ppm/°C provides reliable plated through-hole quality, even in severe thermal shock applications.
Unlike soft PTFE base high performance materials, RO4003C substrate is a rigid, thermoset laminate that can be fabricated using standard FR-4 processes, do not require specialized via preparation processes. This properties allow it to be used in volume manufacturing and get competitively priced.
For RO4003C PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RO4003C PCBs have wide thickness. These are the standard thickness such as 8 mils, 12 mils, 20 mils and 32 mils etc.
Finished copper on PCB is 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.
Solder mask of green, black, red and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating.
We can see its applications in base station antennas, power amplifiers, RF identification tags, automotive radar and sensors etc.
Multi-layer circuit boards on RO4003C are manufactured by combining several cores through bondply RO4450F. In order to save production cost but not reduce signal loss in high frequency environment,
the construction of high frequency materials mixed with FR-4 came into being. At present, the manufacturing technology of hybrid circuit board is mature and they are welcomed in the market.
Thanks for your reading.
Contact Person: Ms. Ivy Deng