The AI wave is reshaping the entire electronic circuit industry chain. High-speed PCBs, semiconductor substrates, packaging substrates, thermal materials, and the global market landscape are all undergoing unprecedented changes. On October 28-29, the 2026 China-Japan Electronic Circuits Autumn Conference and Autumn PCB Technology/Information Forum will be held at the Shenzhen World Exhibition & Convention Center · Bao'an New Hall. The conference is jointly hosted by the China Printed Circuit Association (CPCA) and the Japan Electronics Packaging and Circuits Association (JPCA), with the theme "Innovation-Driven Chips, Intelligent Computing Future," bringing together industry associations, research institutes, leading enterprises, and frontline technical experts from both countries to jointly explore new paths for the PCB industry in the AI era.
The keynote forum of this conference will be held on October 28 in Mangrove Hall A, 2nd Floor, West Side of the South Registration Hall of the exhibition center. Five heavyweight guests will share their insights on core topics such as AI computing power, semiconductor substrates, thermal materials, and market trends.
From trend analysis to technology implementation, a collision of ideas covering the entire industry chain. This keynote forum is not a single technology sharing session, but a complete industry chain exchange:
looking at industry trends—how AI is changing the pace of development of the electronic circuit industry;
looking at material breakthroughs—how copper-clad laminates, semiconductor substrates, and thermal interface materials support higher computing power;
looking at technology implementation—how high-density packaging, high-speed transmission, and thermal management are moving toward industrialization;
looking at the market landscape—what new opportunities and new challenges the global PCB industry chain faces in the AI era.
Whether you come from PCB manufacturing, materials, equipment, packaging, end applications, or investment research, you can find key clues for judging the direction of the industry in this keynote forum.
Conference Information
📅 Conference Time: October 28-29, 2026
📍 Conference Venue: Shenzhen World Exhibition & Convention Center · Bao'an New Hall, No. 1 Zhan Cheng Road, Fu Hai Street, Bao'an District, Shenzhen
🎯 Conference Theme: Innovation-Driven Chips, Intelligent Computing Future
Hosts: China Printed Circuit Association (CPCA), Japan Electronics Packaging and Circuits Association (JPCA)
Organizer: CPCA Science and Technology Working Committee
Media Support: Printed Circuit Information Magazine, PCB Information Network
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Source: CPCA
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