The Rogers TMM13i microwave PCB is a composite of ceramic thermoset polymer, specifically created for strip line and micro-strip applications that need plated thru-hole reliability. It falls under the category of isotropic thermoset microwave materials. Like other materials within the TMM series, TMM 13i combines several advantages of ceramic and PTFE substrates, alongside easy-to-follow soft substrate processing techniques.
The TMM13i PCB boasts an impressive dielectric constant of 12.85 +/-0.35 and a low dissipation factor of 0.0019 at 10GHz, in line with IPC-TM-650. The Thermal Coefficient of Dielectric Constant(TCDC) is -70 ppm/°C - this is a good number. The coefficient of thermal expansion in the X and Y axes is the same at 19 ppm/°C, and rises slightly to 20 ppm/°C in the Z-direction.
The isotropic coefficient of thermal expansion closely aligns with copper of 17 ppm/°C. This feature allows for the production of plated through holes with high reliability and low etch shrinkage values.
Typically, TMM13i PCBs are used in a variety of applications, including global positioning systems antennas, RF and microwave circuitry, power amplifiers and combiners, as well as filters and couplers, patch antennas and dielectric polarizers and lenses.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848