Hello everyone,

Today, we’re going to talk about Rogers’ first high dielectric constant PCB --- RO4360G2 high frequency PCB.

RO4360G2 PCB is glass-reinforced, hydrocarbon ceramic-filled thermoset printed circuit board that provides the ideal balance of performance, and manufacturability is similar to FR-4 PCB. They are lead-free process capable and have better rigidity in multi-layer board constructions, while reducing material and fabrication costs.

The DK value is 6.15 +/- 0.15. It allows our designers to reduce circuit dimensions in applications where size and cost are critical. The dissipation factor is as low as 0.0038 at 10 GHz.

RO4360G2 PCB is also a type of thermal management board with high thermal conductivity of 0.75 W/m-K and high Tg greater than 280 °C.

The CTE on X-axis and Y-axis is 13 and 14 ppm/°C respectively, Z-axis is as low as 28 ppm/°C, these low values provide us with design flexibility and ensure its reliability on plated through holes.

For RO4360G2 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RO4360G2 PCBs have wide thickness. There are the standard thickness such as 12 mils, 20 mils, 32 mils, 60 mils etc. and non-standard thickness such as 8 mils, 16 mils, 24 mils etc.

Finished copper on PCB can be 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.

Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating.

RO4360G2 PCBs are the best choice for engineers working on power amplifiers, patch antennas, ground-based radar, base station power amplifiers, and other general RF applications.

RO4360G2 PCBs are automated assembly compatible and lead free process compatible with reliable plated through holes.They can be paired with RO4450F prepreg and lower-Dk RO4350B, RO4003C in multi-layer designs.