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What circuit boards do we do? (54) WL-CT338 High Frequency PCB
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What circuit boards do we do? (54) WL-CT338 High Frequency PCB

2025-09-16

Latest company case about What circuit boards do we do? (54) WL-CT338 High Frequency PCB

Introduction

WL-CT series laminates are high-frequency materials that combine hydrocarbon resin, ceramic, and glass fiber cloth in a thermosetting resin system, providing low loss performance and meeting high-frequency design requirements. The combination of hydrocarbon resin and composite ceramics in this series results in low loss, high temperature resistance, temperature stability, stable dielectric constant, low thermal expansion coefficient, and a high TG value exceeding 280℃.

 

Features

The dielectric constants of these series range from 3.0 to 6.15, with a dissipation factor ranging from 0.003 to 0.005. For instance, WL-CT338 exhibits a DK value of 3.38 and a DF value of 0.0029.

 

These materials feature a combination of forward rotating ED copper and reverse treated foil (TRF) cladding. The standard options for copper weight include 0.5oz and 1oz, with the possibility of customizing other heavier weights.

 

TRF copper foil is adhesive-backed, resulting in a 7 mil thicker than that of ED copper substrate. The peel strength for these series is 0.72 N/mm.

 

The coefficient of thermal expansion (CTE) in the X/Y direction is matched to copper foil, ranging from 11 to 18 ppm/℃. In the Z direction, minimal expansion is observed, ranging from 31 to 50 ppm/℃.

 

These materials exhibit favorable water absorption rates, ranging from 0.02% to 0.15%. Additionally, they offer high thermal conductivity, ranging from 0.41 to 0.72 W/mK.

 

P/N Dk(εr)@10G Df (tgδ) @10G TcDk ppm/ºC Density (g/cm3) Peel strength (1OZ)N/mm CTE ppm/ºC Water Absorption (%) Thermal Conductivity W/m/°k PIM(dBc)RTF Cu Working Temperature Inflaming retarding UL 94
Typical Designed ED RTF X Y Z
WL-CT300 3.00±0.05 2.98 0.0030 27 1.57 0.85 0.72 15 14 31 0.15 0.41 ≤-158 -55~260 V-0
WL-CT330 3.30±0.06 3.45 0.0026 43 1.82 1.0 0.72 15 13 39 0.02 0.59 ≤-157 -55~260 Non-flame Retardant
WL-CT330Z 3.30±0.06 3.45 0.0030 43 1.78 0.85 0.72 16 13 39 0.05 0.59 ≤-157 -55~260 V-0
WL-CT338 3.38±0.05 3.55 0.0029 45 1.78 1.0 0.72 14 16 50 0.04 0.70 ≤-158 -55~260 Non-flame Retardant
WL-CT350 3.48±0.05 3.66 0.0039 52 1.90 0.85 0.72 11 14 34 0.05 0.70 ≤-157 -55~260 V-0
WL-CT440 4.10±0.08 4.38 0.0050 -21 2.00 1.0 N/A 14 18 35 0.12 0.66 N/A -55~260 V-0
WL-CT615 6.15±0.15 6.40 0.0040 -122 2.18 0.9 N/A 15 17 33 0.08 0.72 N/A -55~260 V-0

 

PCB Capability 

We specialize in offering WL-CT338 PCBs with a wide range of capabilities and specifications.

 

Layer count includes single-sided, double-sided, multilayer, and hybrid PCBs.

 

Flexible options for finished copper weight, with choices of 1oz and 2oz.

 

Various dielectric thickness options, depending on the type of copper used. For ED Copper, we offer thicknesses ranging from 4mil to 80mil, and for TRF Copper, thicknesses ranging from 8.7mil to 80.7mil.

 

Our capability supports PCB sizes up to 400mm X 500mm, providing flexibility for designing your PCB layout.

 

A wide selection of solder mask colors, including green, black, blue, yellow, red, and more, allowing you to choose the desired color for your PCB.

 

Different surface finish options to meet your specific requirements. These options include bare copper, HASL, ENIG, immersion silver, immersion tin, OSP, pure gold, and ENEPIG.

 

PCB Material: Hydrocarbon resin, ceramic, and glass fiber cloth
Designation WL-CT338 DK DF
3.38±0.05 0.0029
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness ED Copper TRF Copper
4mil /
8mil 8.7mil
12mil /
16mil /
20mil 20.7mil
28mil /
32mil 32.7mil
40mil 40.7mil
60mil 60.7mil
80mil 80.7mil
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

Applications

WL-CT338 PCBs offer versatility and can be applied in a wide range of applications, including base station antennas, satellite antennas, automotive radar systems, WIMAX antennas, distributed antennas, and miniature patch antennas etc.

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