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TMM3 Introduction
Rogers TMM3 thermoset microwave material is a ceramic thermoset polymer composite specifically engineered for strip-line and micro-strip applications requiring high plated thru-hole reliability.
TMM3 laminates offer a unique blend of advantages found in both ceramic and traditional PTFE microwave circuit laminates, eliminating the need for complex production techniques associated with these materials. These laminates leverage thermoset resins, ensuring exceptional reliability for wire-bonding processes while mitigating concerns such as pad lifting or substrate deformation.
Features & Benefits
TMM3 laminates possess a dielectric constant (Dk) of 3.27 +/- .032, ensuring precise and consistent signal transmission, exhibiting a dissipation factor of just .002 at 10GHz. This low dissipation factor ensures that the PCBs experience minimal signal loss, enabling efficient and effective communication within the circuitry.
The thermal coefficient of Dk is 37ppm/°K, providing stability even in varying temperature conditions. Moreover, the coefficient of thermal expansion is precisely matched to copper, mitigating potential issues related to thermal stress.
TMM3 materials possess mechanical properties that resist creep and cold flow, ensuring long-term reliability. They are also resistant to process chemicals, reducing the risk of damage during fabrication. Additionally, it eliminates the need for a sodium napthanate treatment prior to electroless plating, streamlining the manufacturing process.
Capability
In terms of our PCB capabilities on TMM3 substrates, we can offer a wide range of options to meet your specific requirements.
Whether you need double layer, multilayer, or hybrid PCBs, we have you covered.
You can select from different copper weights, including 0.5oz (17 µm), 1oz (35µm), and 2oz (70µm), to achieve optimal conductivity.
Our PCB thickness options range from 15mil (0.381mm) to 500mil (12.7mm), catering to various application needs.
The maximum PCB size we can handle is 400mm X 500mm. We offer a variety of solder mask colors, such as green, black, blue, yellow, and red.
Additionally, you can choose from a range of surface finishes, including bare copper, HASL, ENIG, OSP, immersion tin, immersion silver, pure gold, and ENEPIG.
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM3 |
| Dielectric constant: | 3.27 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold, ENEPIG etc.. |
Applications
TMM3 Microwave PCBs find extensive applications in various industries. They are perfect for RF and microwave circuitry, power amplifiers and combiners, filters and couplers, satellite communication systems, Global Positioning Systems (GPS) antennas, patch antennas, dielectric polarizers and lenses, as well as chip testers.