English
Introduction
RO3006 circuit materials are specifically developed for high frequency applications in commercial microwave and RF systems. These materials are composed of ceramic-filled PTFE composites and are designed to provide outstanding electrical and mechanical stability at competitive prices. The advanced nature of RO3006 circuit materials ensures a consistent dielectric constant (Dk) across a wide temperature range, eliminating the abrupt change in Dk typically observed in PTFE glass materials near room temperature.
Features
RO3006 offers a dielectric constant (Dk) of 6.15 +/- 0.15, ensuring reliable signal transmission and precise impedance control.
With a dissipation factor of 0.0020 at 10 GHz, RO3006 facilitates low signal loss, making it ideal for high-frequency designs.
Moreover, RO3006 features an impressively low coefficient of thermal expansion (CTE) across the X, Y, and Z axes, measuring at 17, 17, and 24 ppm/°C respectively. This characteristic ensures excellent dimensional stability and minimizes phase shift, even when subjected to varying temperature conditions
The uniform mechanical properties shared with other laminates in the RO3000 Series facilitate seamless integration into multi-layer board designs, promoting compatibility and ease of fabrication.
| PCB Capability (RO3006) | |
| PCB Material: | Ceramic-filled PTFE Composites |
| Designation: | RO3006 |
| Dielectric constant: | 6.15 |
| Dissipation Factor: | 0.002 10GHz |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, Bare Copper, OSP, Pure thick gold etc.. |
PCB Capability
Our manufacturing capabilities include single-sided, double-sided PCBs, multilayer PCBs, and hybrid PCBs, allowing flexibility in accommodating various design requirements.
We offer copper weight options of 1oz (35µm) and 2oz (70µm), providing choices to meet specific conductivity needs.
Laminate thickness options range from 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), up to 60mil (1.524mm), ensuring versatility for different applications.
The maximum size we support for PCBs is 400mm X 500mm, enabling the realization of larger designs.
We offer a range of solder mask colors, including green, black, blue, yellow, red, and more, allowing customization to suit specific requirements.
When it comes to surface finish, we offer multiple options, including immersion gold, HASL, immersion silver, immersion tin, ENEPIG, bare copper, OSP, pure thick gold and so on.
Applications
RO3006 PCB finds application in various fields, including:
Automotive radar systems
Global positioning satellite (GPS) antennas
Power amplifiers and antennas in cellular telecommunications systems
Patch antennas for wireless communications
Direct broadcast satellites and so on.
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