PCB (Printed Circuit Board) is a key component in the electronic industry, and its demand is expected to grow in the medium and long-term due to the development of various industries. Two areas of growth for PCBs are the automotive electronics field, particularly for new energy vehicles, and the data communication field, including servers and 5G communication base stations.
The global sales of new energy vehicles are expected to reach 10.1 million in 2022, up 55% from 2021. The demand for automotive PCBs for new energy vehicles is several times that of traditional fuel vehicles. As vehicles transition from human driving to automatic driving and digital upgrades and intelligent networking promote the development of the intelligent cockpit, the demand for automotive PCBs is expected to further increase.
In the data communication field, the global cloud computing market is in a period of rapid growth, and the size of the data center market is expected to reach US$74.65 billion in 2022, up 9.90% from 2021. The domestic data center market has also seen significant growth due to the rapidly growing demand for cloud computing in downstream industries such as the Internet, cloud computing, and artificial intelligence. The key equipment of the data center, the server, accounts for 60-70% of the overall cost, and its market demand is still growing.
The popularization of 5G infrastructure will also greatly benefit the development of communication PCBs. The number and technical content of PCBs used in infrastructure such as ultra-large-capacity and ultra-fast computing server systems and ultra-large data storage systems have increased significantly, which has greatly increased the value of communication PCBs compared with 4G. The market demand for 5G application terminals will also increase accordingly, which will drive the increase in demand for communication PCBs.
In addition to these two areas, the wind power storage industry has also ushered in rapid development, and the demand for PCBs in related electronic devices such as photovoltaic inverters, energy storage inverters, and energy storage battery packs is expected to grow.
In these fields where there is a growing demand for PCBs, they have a common characteristic: higher requirements for the board material. The quality of the board material directly affects the frequency conversion of the entire design and the smoothness of signal transmission. Therefore, high-quality PCBs are crucial in the entire process. Most of the PCBs provided by Bicheng are related to high-frequency signal transmission. These PCBs are mainly used in cellular base station antennas, automotive radar and sensors, 5G, mobile communication systems, etc. For example, we have received good feedback from customers for the high-frequency board 32mil RO4003C.
Ii is made of high-quality Rogers RO4003C material that ensures reliable performance even in challenging environments. The lead-free process used in its construction makes it an environmentally friendly choice. With a wide operating temperature range of -40℃ to +85℃, this PCB is designed to withstand extreme temperature conditions.
The stack-up of this PCB comprises of base copper of 17um, a dielectric layer of 32mil, and another base copper layer of 17um, providing excellent electrical characteristics and mechanical stability. The PCB dimensions are 180 x 156 mm, with a thickness of 0.98 mm, and a finished copper weight of 1 oz (1.4 mils) across all layers.
The construction details of this PCB include minimum trace/space of 6/6 mils and minimum hole size of 15 mils, making it ideal for complex and high-density applications. It also features plated-through slotted holes and no blind or buried vias, ensuring seamless connectivity and ease of assembly. The surface finish of this PCB is ENIG (Immersion gold), which provides excellent corrosion resistance, and the top solder mask is green.
This PCB comes with a panelized solder paste stencil for the top side, making it easy to assemble components with precision. A total of 210 components, 306 pads, 129 through-hole pads, 90 top SMT pads, 87 bottom SMT pads, 331 vias, and 118 nets are included.
We provide prototype, small batches and volume production here. If you are interested in RO4003C high frequency PCB, we’d love to share the price with you. You can contact Ivy at sales10@bichengpcb.com.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848