Introduction
Wangling’s TFA300 high frequency material utilizes a large amount of uniform special nano-ceramics mixed with PTFE resin, eliminating the fiberglass effect during the propagation of electromagnetic waves.
A new manufacturing process is employed to create prefabricated sheets, which are pressed using a special lamination process. This material exhibits outstanding electrical, thermal, and mechanical properties with excellent dielectric constant at the same level, making it an aerospace-grade high-frequency and high-reliability material that can replace similar foreign products.
Features
TFA300 features a low dielectric constant of 3 at 10GHz, enabling minimal signal delay and optimal impedance control for high-speed/high-frequency applications (e.g., 5G, radar, mmWave circuits).
Ultra-low dissipation factor of 0.001 at the same frequency ensures minimal signal loss and high-quality signal integrity in RF/microwave PCBs and antennas.
It also features a great TCDk value of -8 PPM/℃,providing exceptional dielectric constant stability across a wide temperature range (-40°C to +150°C), critical for automotive, aerospace, and outdoor telecom systems.
The peel strength is greater than 1.6N/mm, indicating superior adhesion between copper layers and substrate, reducing delamination risks in multilayer PCBs.
18 PPM/ºC of X/Y axis CTE, closely matching copper’s CTE of 17 ppm/°C, minimizes the stress-induced warpage during thermal cycling. 30 ppm/°C of Z axis, balances rigidity and flexibility for reliable plated through-hole (PTH) integrity.
TFA300 also shows low water absorption of 0.04%, a higher thermal conductivity of 0.8W/MK.
Finally, it meets the flammability standard of UL-94 V-0.
| PCB Material: |
Nano-ceramics mixed with PTFE resin |
| Designation: |
TFA300 |
| Dielectric constant: |
3 ±0.04 |
| Dissipation factor: |
0.001 |
| Layer count: |
Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: |
1oz (35µm), 2oz (70µm) |
| Dielectric thickness: |
5mil (0.127mm), 10mil (0.254mm),20mil(0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm),50mil(1.27mm), 60mil(1.524mm),75mil(1.905mm), 80mil(2.03mm), 100mil(2.54mm), 125mil(3.175mm),150mil(3.81mm), 160mil(4.06mm), 200mil(5.08mm), 250mil(6.35mm) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red, Purple, etc. |
| Surface finish: |
Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
PCB Capability
We specialize in delivering high-quality TFA300 PCBs tailored to meet your diverse design and performance requirements.
Layer Count: We can provide you with Single-sided, Double-sided, Multi-layer and Hybrid PCBs (mixed materials).
Copper Weight: You can choose 1oz (35µm) for standard signal integrity, or 2oz (70µm) for enhanced current-carrying capacity and thermal management.
Dielectric Thickness: We offer extensive options from 5mil (0.127mm) to 250mil (6.35mm), enabling precise impedance control and adaptability for high-frequency applications.
PCB Size: We can supply a large panel up to 400mm x 500mm with single board or multiple designs.
Solder Mask Colors: It’s available in Green, Black, Blue, Yellow, Red, and more.
Surface Finishes: Immersion Gold (ENIG), HASL (Lead-Free),Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare copper and Pure Gold are available in house.
Applications
TFA300 PCBs are typically used in aerospace and aviation equipment, phase-sensitive antennas, airborne radar, Satellite communication, and navigation etc.
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