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6-Layer Hybrid PCB built on 12mil RO4003C and FR-4 Substrates

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June 09, 2026
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Video Description:
Step into our short showcase to explore how Bicheng Electronics combines Rogers RO4003C and FR-4 materials in a 6-layer hybrid PCB. See the manufacturing process, layer stack-up details, and learn how this advanced construction supports high-frequency performance while maintaining cost efficiency for applications in telecommunications, radar systems, and satellite communications.
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