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Product Details:
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| Material: | RO4360G2 | PCB Size: | 68.35mm X 41.4 Mm=1PCS |
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| Copper Weight: | 1OZ | Surface Finish: | Immersion Gold |
| Layer Count: | 2 Layers | PCB Thickness: | 0.6mm |
The newly shipped RO4360G2 2-Layer Rigid PCB is a cutting-edge product that combines performance and processing capability, making it ideal for a wide range of applications. Let's delve into the key features and benefits of this exceptional PCB:
Features:
- Dielectric constant (Dk) of 6.15+/- 0.15 at 10 GHz/23°C: Ensures reliable signal transmission and optimal performance.
- Dissipation factor of 0.0038 at 10 GHz/23°C: Minimizes signal loss, maintaining signal integrity.
- High Thermal Conductivity of 0.75 W/mK: Efficient heat dissipation, enhancing reliability and performance.
- Low Z-axis coefficient of thermal expansion at 28 ppm/°C: Ensures dimensional stability under varying temperatures.
- Lead-free Process Compatible, 94V-0 flammability: Environmentally friendly and meets stringent safety requirements.
| RO4360G2 Typical Value | |||||
| Property | RO4360G2 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz/23℃ | |||||
| Dissipation Factor,tanδ | 0.0038 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Conductivity | 0.75 | W/mK | 50℃ | ASTM D-5470 | |
| Volume Resistivity | 4.0 X 1013 | Ω.cm | Elevated T | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 9.0 X 1012 | Ω | Elevated T | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 784 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Tensile Strength | 131 (19) 97(14) | X Y | MPa (kpsi) | 40 hrs 50%RH/23 | ASTM D638 |
| Flexural Strength | 213(31) 145(21) | X Y | Mpa (kpsi) | 40 hrs 50%RH/23 | IPC-TM-650, 2.4.4 |
| Coefficient of Thermal Expansion | 13 14 28 | X Y Z | ppm/℃ | -50 ℃to 288℃ After Replicated Heat Cycle | IPC-TM-650, 2.1.41 |
| Tg | >280 | ℃ TMA | IPC-TM-650 2.4.24.3 | ||
| Td | 407 | ℃ | ASTM D3850 using TGA | ||
| T288 | >30 | Z | min | 30 min / 125℃ Prebake | IPC-TM-650 2.2.24.1 |
| Moisure Absorption | 0.08 | % | 50℃/48hr | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Thermal Coefficient of er | -131 @10 GHz | Z | ppm/℃ | -50℃ to 150 ℃ | IPC-TM-650, 2.5.5.5 |
| Density | 2.16 | gm/cm3 | RT | ASTM D792 | |
| Copper Peel Stength | 5.2 (0.91) | pli (N/mm) | Condtion B | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 File QMTS2. E102765 | |||
Benefits:
- Design flexibility: RO4360G2 offers design flexibility, allowing for innovative and customized applications.
- Plated through-hole reliability: Ensures robust and reliable connections for components.
- Automated assembly compatible: Facilitates efficient and streamlined manufacturing processes.
- Environmentally friendly - Lead-free process compatible: Supports eco-friendly initiatives and compliance with regulations.
- Efficient supply chain and short lead times: Cost-effective material option with quicker turnaround.
The RO4360G2 2-Layer Rigid PCB is designed with meticulous construction details to meet your specific requirements. The board dimensions of 68.35mm x 41.4mm provide a compact yet functional size, while the minimum trace width of 4 mils and space of 6 mils ensure precise signal routing. With a finished board thickness of 0.6mm and a finished copper weight of 1 oz (1.4 mils) on the outer layers, this PCB offers a slim profile without compromising on conductivity. The 20 μm via plating thickness and immersion gold surface finish ensure reliable electrical connections and excellent solderability. The top and bottom green solder mask provide protection and visual clarity, while the 100% electrical test before shipment guarantees quality. Additionally, the inclusion of 0.5mm vias filled with resin and capped enhances structural integrity. Supporting 11 components, 70 pads (46 thru-hole and 24 top SMT), and 35 vias, this PCB offers versatility for various applications.
The PCB statistics showcase its key characteristics. With 3 nets, the PCB enables multiple signal paths, and its precise design facilitates efficient interconnection. Whether you require reliable through-hole connections or surface mount technology, the RO4360G2 PCB is equipped with 46 thru-hole pads and 24 top SMT pads. The absence of bottom SMT pads ensures optimized layout options. These construction details and statistics highlight the precision, reliability, and versatility of the RO4360G2 2-Layer Rigid PCB, making it an excellent choice for diverse electronic applications.
Accepted Standard: IPC-Class-2.
| PCB Material: | Hydrocarbon Ceramic-filled Thermoset Materials |
| Designation: | RO4360G2 |
| Dielectric constant: | 6.15 ±0.15 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Applications:
- Base Station Power Amplifiers: Achieve high-performance power amplification for base stations.
- Small Cell Transceivers: Enable efficient and reliable communication in small cell transceiver systems.
Availability: The RO4360G2 PCB is available worldwide, ensuring accessibility for global customers.
Experience the power and efficiency of RO4360G2 2-Layer Rigid PCB in your next project. Contact us today to explore the limitless possibilities this exceptional PCB offers!
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
