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Product Details:
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| Material: | RO4350B | PCB Size: | 106.84mm X 60.8 Mm=1PCS, +/- 0.15mm |
|---|---|---|---|
| Copper Weight: | 1OZ | Surface Finish: | Immersion Silver |
| Layer Count: | 2 Layers | PCB Thickness: | 0.6mm |
Introducing one newly shipped PCB built on RO4350B laminate. It's a high-performance laminate that combines the electrical properties of PTFE/woven glass with the manufacturability of epoxy/glass. With its proprietary woven glass reinforced hydrocarbon/ceramic materials, the RO4350B offers exceptional electrical performance while being cost-effective to produce.
The RO4350B laminates provide precise control over the dielectric constant (Dk) and maintain low loss, using the same processing methods as standard epoxy/glass laminates. Unlike conventional microwave laminates, RO4350B laminates do not require special through-hole treatments or handling procedures, simplifying the manufacturing process. Additionally, these materials are UL 94 V-0 rated, ensuring their suitability for active devices and high-power RF designs.
With a dielectric constant of DK 3.48 +/-0.05 at 10GHz/23°C and a dissipation factor of 0.0037 at 10GHz/23°C, the RO4350B PCB ensures accurate and reliable signal transmission. It exhibits a thermal conductivity of 0.69 W/m/°K, contributing to efficient heat dissipation. The PCB demonstrates a low coefficient of thermal expansion (CTE) with 10 ppm/°C for the X axis, 12 ppm/°C for the Y axis, and 32 ppm/°C for the Z axis. It also possesses a high Tg value of >280 °C, ensuring stability under elevated temperatures. With a low water absorption rate of 0.06%, the PCB maintains excellent dimensional stability.
The RO4350B PCB offers numerous benefits for your applications. It is ideal for multi-layer board (MLB) constructions and can be processed like FR-4 at a lower fabrication cost, providing a cost-effective solution for high-performance designs. Additionally, it offers excellent dimensional stability, ensuring reliable performance in demanding environments. The RO4350B PCB is competitively priced, offering exceptional value for its performance capabilities.
| RO4350B Typical Value | |||||
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 390 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | (3)V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
This particular PCB features a 2-layer rigid board stackup with copper_layer_1 (70 μm), a 0.508 mm (20mil) Rogers RO4350B core, and copper_layer_2 (70 μm). This configuration provides structural integrity and optimal electrical performance for your designs.
This PCB measures 106.84mm x 60.8mm with a tolerance of +/- 0.15mm. It features a minimum trace/space of 4/5 mils and a minimum hole size of 0.3mm. There are no blind vias. The finished board thickness is 0.6mm with a 1oz (1.4 mils) outer layer copper weight. The via plating thickness is 20 μm. The surface finish is immersion silver, providing excellent solderability and corrosion resistance. The PCB does not have top or bottom silkscreen or solder mask. Each board undergoes a comprehensive 100% electrical test to ensure its performance and reliability.
Each PCB adheres to IPC-Class-2 quality standards, ensuring high-quality manufacturing processes and reliable performance. It is available worldwide, catering to customers globally.
The RO4350B PCB finds applications in various industries. It is well-suited for cellular base station antennas and power amplifiers, offering excellent signal transmission and power handling capabilities. It is also suitable for RF identification tags, automotive radar, sensors, and LNB's (Low-Noise Block Downconverters) for direct broadcast satellites. Choose the RO4350B PCB for outstanding electrical performance, cost-effective fabrication, and reliable functionality in demanding applications.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
