Multilayer Blind Via PCB,
Immersion Gold Plating Blind Via PCB,
Rogers 3003 PCB Material
Introducing our latest addition to the world of printed circuit boards (PCBs), a newly shipped PCB that combines advanced technology, reliable performance, and global availability. Constructed with precision and quality in mind, this PCB offers exceptional features to meet the demands of diverse applications. Let's dive into the key details of this impressive PCB.
PCB Material and Stackup:
The foundation of this PCB lies in the high-quality Rogers RO3003 ceramic-filled PTFE composites. With a dielectric constant of 3.0 at 10 GHz and a dissipation factor of 0.001 at 10 GHz, this material ensures optimal signal integrity and efficient signal transmission. The PCB operates flawlessly within a temperature range of -40℃ to +85℃, making it suitable for various environmental conditions.
This 8-layer rigid PCB boasts a meticulous stackup configuration that enhances its performance. The copper layers, measuring 18 μm each, are interspersed with Rogers 3003 substrates, each 0.127 mm thick. Bondply 2929, with a thickness of 0.076 mm, provides stability and reinforcement between the copper layers and substrates.
Construction Details and Specifications:
The newly shipped PCB comes with precise construction details and specifications to meet your project's requirements. The board dimensions measure 237mm x 70.1mm with a tolerance of +/- 0.15mm, ensuring a precise fit. The minimum trace/space is 4/4 mils, allowing for intricate circuitry designs, while the minimum hole size is 0.4mm.
Featuring blind vias on layers L5-L8, this PCB offers greater flexibility in routing and interconnectivity. With a finished board thickness of 1.0mm and a finished copper weight of 0.5 oz (0.7 mils) for inner layers and 1 oz (1.4 mils) for outer layers, this PCB strikes the perfect balance between durability and compactness. The via plating thickness measures 1 mil, ensuring reliable electrical connections.
To protect the PCB and enhance its longevity, it is finished with immersion gold, providing excellent corrosion resistance and solderability. The top and bottom silkscreens are in white, providing clear labeling and identification. The green top and bottom solder masks offer reliable protection against environmental factors, while ensuring efficient soldering.
Quality Standards and Availability:
This newly shipped PCB adheres to the IPC-Class-2 quality standard, guaranteeing high-quality manufacturing and reliable performance. It undergoes a 100% electrical test, ensuring that every aspect of its functionality is thoroughly examined and meets the highest industry standards.
With worldwide availability, this PCB can be delivered to customers around the globe. For further information or to discuss your specific requirements, please contact Ivy at email@example.com.
In conclusion, our newly shipped PCB combines advanced technology, meticulous construction, and adherence to quality standards. With its exceptional features and global availability, this PCB is ready to empower your electronic projects and meet the demands of today's rapidly evolving industry.
|RO3003 Typical Value|
|Dielectric Constant,εProcess||3.0±0.04||Z||10 GHz/23℃||IPC-TM-650 188.8.131.52 Clamped Stripline|
|Dielectric Constant,εDesign||3||Z||8GHz to 40 GHz||Differential Phase Length Method|
|Dissipation Factor,tanδ||0.001||Z||10 GHz/23℃||IPC-TM-650 184.108.40.206|
|Thermal Coefficient of ε||-3||Z||ppm/℃||10 GHz -50℃to 150℃||IPC-TM-650 220.127.116.11|
|mm/m||COND A||IPC-TM-650 2.2.4|
|Volume Resistivity||107||MΩ.cm||COND A||IPC 18.104.22.168|
|Surface Resistivity||107||MΩ||COND A||IPC 22.214.171.124|
|MPa||23℃||ASTM D 638|
|Moisture Absorption||0.04||%||D48/50||IPC-TM-650 126.96.36.199|
|Thermal Conductivity||0.5||W/M/K||50℃||ASTM D 5470|
|Coefficient of Thermal Expansion
(-55 to 288℃)
|ppm/℃||23℃/50% RH||IPC-TM-650 188.8.131.52|
|Td||500||℃ TGA||ASTM D 3850|
|Density||2.1||gm/cm3||23℃||ASTM D 792|
|Copper Peel Stength||12.7||Ib/in.||1oz,EDC After Solder Float||IPC-TM 2.4.8|
|Lead-free Process Compatible||Yes|
Deep Dive into RO3003: A Versatile PCB Material for High-Frequency Applications
RO3003, a ceramic-filled PTFE composite, has gained significant traction in the world of printed circuit boards (PCBs) due to its exceptional properties and suitability for high-frequency applications. In this article, we will explore the various aspects of RO3003 and delve into its advantages, construction details, and performance characteristics. From dielectric constant to thermal conductivity, we will uncover why RO3003 is a top choice for demanding electronic projects.
RO3003: Unveiling the Key Properties of a High-Performance PCB Material
RO3003 is renowned for its excellent dielectric properties, making it an ideal material for high-frequency applications. With a dielectric constant of 3.0±0.04 (as per the process) and 3 (as per the design) at 10 GHz, RO3003 ensures superior signal integrity and minimal loss. This is further supported by its low dissipation factor (tanδ) of 0.001 at 10 GHz, ensuring efficient signal transmission.
Temperature Stability and Dimensional Precision
One of the standout features of RO3003 is its remarkable thermal stability. With a thermal coefficient of ε of -3 ppm/℃ at 10 GHz and a broad operating range from -50℃ to 150℃, RO3003 maintains its performance even in extreme temperature conditions. Additionally, its exceptional dimensional stability, with a variation of only 0.06 mm/m (X) and 0.07 mm/m (Y) under COND A conditions, guarantees precise and reliable PCB manufacturing.
Electrical and Mechanical Performance
RO3003 exhibits impressive electrical properties, including a volume resistivity and surface resistivity of 10^7 xn--M-jlb.cm and 10^7 MΩ, respectively, under COND A conditions. This ensures excellent insulation and prevents leakage currents. Moreover, its high tensile modulus, with values of 930 MPa (X) and 823 MPa (Y) at 23℃, enhances the structural integrity of PCBs made with RO3003.
Reliability and Environmental Resilience
When it comes to environmental resilience, RO3003 excels. It boasts a low moisture absorption rate of 0.04% according to D48/50 testing, making it suitable for applications in humid environments. The material's thermal conductivity of 0.5 W/M/K at 50℃ facilitates efficient heat dissipation, preventing thermal stress and ensuring optimal performance.
Compatibility and Safety Standards
RO3003 is designed to meet stringent quality standards. It has a coefficient of thermal expansion of 17 ppm/℃ (X), 16 ppm/℃ (Y), and 25 ppm/℃ (Z) at 23℃/50% RH, as per IPC-TM-650 184.108.40.206. This ensures stability and reliability under varying temperature conditions. Additionally, RO3003 is lead-free process compatible, aligning with industry requirements and environmental regulations. The material also exhibits excellent flammability resistance, being rated V-0 according to UL 94 standards.
RO3003 stands out as a versatile and high-performance PCB material specifically designed for high-frequency applications. Its exceptional dielectric properties, temperature stability, dimensional precision, and environmental resilience make it a preferred choice for demanding electronic projects. Whether it's for telecommunications, aerospace, or high-speed data applications, RO3003 delivers reliable and efficient performance. With its compatibility with lead-free processes and adherence to safety standards, RO3003 ensures both quality and compliance. Embrace the power of RO3003 and unlock the full potential of your high-frequency projects.
Contact Person: Ms. Ivy Deng