High Frequency Electronics RF PCB Board With RO4003C

Our newly shipped double-sided PCB has been manufactured using high-quality Rogers RO4003C material and a lead-free process to promote environmental sustainability. It has been designed to operate in a wide temperature range of -40℃ to +85℃, making it suitable for a variety of applications.

The PCB stack-up comprises a base copper layer of 17um, a 60mil RO4003C dielectric layer, and another base copper layer of 17um. The finished board thickness is 1.6mm, and the finished copper weight is 1 oz (1.4 mils) for all layers. The minimum trace and space are 14/14 mils, and the minimum hole size is 20 mils. No blind or buried vias are present, and the via plating thickness is 1 mil.

With dimensions of 510mm x 150mm and a tolerance of +/-0.15mm, this PCB is designed to suit a wide range of applications. It features 23 components, 191 total pads, 152 thru-hole pads, 39 top SMT pads, 0 bottom SMT pads, 161 vias, and 9 nets. The PCB has undergone a 100% electrical test to ensure its quality and reliability.

The surface finish of this PCB is HASL lead-free, and it does not have any top silkscreen, bottom silkscreen, or top/bottom solder mask. For any technical queries, please contact Ivy at sales10@bichengpcb.com.

Overall, a durable and reliable choice for your electronic projects, this newly shipped PCB has been manufactured using high-quality materials and subjected to rigorous testing to ensure optimal performance and longevity.

How RO4003C Can Help You Achieve Superior Signal Integrity and High-Frequency Performance

----Thermal conductivity of RO4003C and its relevance in heat management

RO4003C is an exceptional PCB material that boasts unique properties that make it an ideal choice for high-frequency applications. As a high-ranking sales manager, I will take you through an in-depth and informative article on the advantages of RO4003C and the properties that make it a superior choice for high-speed PCB designs.

Introduction to RO4003C and its Unique Properties

RO4003C is an advanced double-sided PCB material that has a dielectric constant of 3.38±0.05 (at 10 GHz/23℃) and a design dielectric constant of 3.55 (at 8 to 40 GHz). These properties make it an excellent choice for high-frequency applications that require superior signal integrity. RO4003C's unique properties include a low dissipation factor of 0.0027 (at 10 GHz/23℃) and a low thermal coefficient of ε, making it an outstanding choice for applications that require thermal stability.

Dissipation Factor and Thermal Coefficient of RO4003C

RO4003C's low dissipation factor of 0.0027 (at 10 GHz/23℃) and 0.0021 (at 2.5 GHz/23℃) make it an ideal choice for high-frequency applications that require minimal signal loss. The thermal coefficient of ε ranges from -50℃ to 150℃, making it an excellent choice for applications that require thermal stability.

Volume Resistivity and Surface Resistivity of RO4003C

RO4003C's volume resistivity is 1.7 x 1010 MΩ.cm (COND A), and its surface resistivity is 4.2 x 109 MΩ (COND A), making it an exceptional choice for applications that require high insulation resistance.

Electrical Strength and Mechanical Properties of RO4003C

RO4003C has an excellent electrical strength of 31.2 (780) Kv/mm (v/mil) (at 0.51mm/0.020") and a high tensile modulus of 19,650 (2,850) MPa (ksi) (X) and19,450 (2,821) MPa (ksi) (Y) at room temperature. It also exhibits a high tensile strength of 139 (20.2) MPa (ksi) (X) and 100 (14.5) MPa (ksi) (Y) at room temperature, making it a reliable choice for applications that require high mechanical strength.

Dimensional Stability and Coefficient of Thermal Expansion of RO4003C

RO4003C exhibits excellent dimensional stability, with a maximum value of <0.3 mm/m (mil/inch) after etch+E2/150℃. Its coefficient of thermal expansion ranges from 11 ppm/℃ to 46 ppm/℃ (X, Y, Z) from -55℃ to 288℃, making it an ideal choice for applications that require stable mechanical properties over a wide temperature range.

Tg and Td of RO4003C and their Impact on High-Frequency PCB Design

RO4003C has a glass transition temperature (Tg) of >280℃ (TMA A) and a decomposition temperature (Td) of 425℃ (TGA), making it an excellent choice for high-temperature applications. Its high Tg also makes it suitable for lead-free process compatibility.

Thermal Conductivity of RO4003C and its Relevance in Heat Management

RO4003C has a thermal conductivity of 0.71 W/M/oK (at 80℃), making it a reliable choice for applications that require efficient heat management.

Moisture Absorption and Copper Peel Strength of RO4003C

RO4003C has a low moisture absorption of 0.06% (after 48hrs immersion at 50℃), making it an excellent choice for applications that require high dimensional stability in humid environments. Its copper peel strength is 1.05 N/mm (pli) (after solder float 1 oz. EDC Foil).

Lead-free Process Compatibility of RO4003C

RO4003C is compatible with lead-free processes, making it an eco-friendly choice for high-frequency PCB designs.

In conclusion, RO4003C is a high-performance PCB material that offers unique properties ideal for high-frequency applications. Its low dissipation factor, thermal stability, excellent mechanical and electrical properties, and lead-free process compatibility make it an optimal choice for high-speed PCB designs. By choosing RO4003C, you can unlock the full potential of your high-frequency electronics and achieve superior signal integrity and performance.