Rogers TMM10 PCB Material For High PTH Hole Reliability

In this article, I will be discussing the TMM10 PCB, which is a type of thermoset microwave material. The Rogers TMM10 PCB is a composite material made of ceramic and thermoset polymer that is designed for high PTH hole reliability in strip-line and micro-strip applications. It combines the benefits of both PTFE and ceramic-based substrates, but is not limited by the same mechanical properties and production techniques.

According to the TMM10 data sheet, this material has a high dielectric constant with a process Dk value of 9.2, which makes it suitable for devices that require a small volume in size, such as filters and couplers. The dissipation factor is very low at 0.0022 at 10 GHz. The thermal coefficient of dielectric constant (TCDk) is also desirable, as it is less than |50| ppm/°C. This makes it ideal for use in applications that require boards to be mounted in highly variable temperature environments, such as automotive electronics or 5G base stations.

TMM10 has good volume and surface resistivity, and is able to withstand a decomposition temperature (Td) of up to 425℃ (determined by Thermogravimetric Analysis - TGA), which is a safe temperature during PCB assembly. Its coefficient of thermal expansion is similar to that of copper, which ensures that its mechanical properties resist creep and cold flow. TMM10 is also a sort of thermal management board, with a thermal conductivity of 0.76 W/m/K.

The copper peel strength after thermal stress is 5.0 lbs/inch (0.9 N/mm). The flexural strength in machine direction and cross direction is 13.62 Kpsi, and the flexural modulus is 1.79 Mpsi. Moisture absorption for 1.27mm material is 0.09%, and 0.2% for 3.18mm thickness. The specific gravity is 2.77, and the specific heat capacity is 0.74 J/g/K. TMM10 is lead-free process compatible.

TMM10 PCBs are available in a variety of thicknesses, including 20 mils, 30 mils, 50 mils, and 60 mils. Higher thicknesses, such as 200 mils, 300 mils, and 500 mils, are also available. The maximum PCB size on high-frequency materials is 400mm by 500mm, and TMM10 PCBs can be made into single layer, double layer, multi-layer, and hybrid designs. Solder masks in various colors are available in-house, and a range of protective coatings, including immersion gold, HASL, immersion silver, and immersion tin, as well as OSP, ENEPIG, and pure gold, can be used to protect the SMD pads.

TMM10 materials are resistant to process chemicals, reducing damage during the circuit fabrication process. They do not require a sodium napthanate treatment prior to electroless plating, and the thermoset resin allows for reliable wire-bonding. Applications for TMM10 PCBs include power amplifiers and combiners, filters and couplers, satellite communication systems, global positioning systems antennas, and patch antennas.