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High Tg Printed Circuit FR4 PCB Board With Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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High Tg Printed Circuit FR4 PCB Board With Immersion Gold

High Tg Printed Circuit FR4 PCB Board With Immersion Gold
High Tg Printed Circuit FR4 PCB Board With Immersion Gold High Tg Printed Circuit FR4 PCB Board With Immersion Gold High Tg Printed Circuit FR4 PCB Board With Immersion Gold High Tg Printed Circuit FR4 PCB Board With Immersion Gold

Large Image :  High Tg Printed Circuit FR4 PCB Board With Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-501.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: FR-4 TU-872 SLK Sp PCB Thickness: 1.61-1.62mm
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

Printed Circuit FR4 PCB Board

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High Tg FR4 PCB Board

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Immersion Gold FR4 PCB Board

 

High Tg Printed Circuit Board (PCB) Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of low DK/DF FR-4 PCB which is built on TU-872 SLK Sp material. It is made on 4 layers copper with 1oz each layer, coating immersion gold and green solder mask. Final finished thickness is 1.6mm +/- 10%. A panel consists of 16 pieces.

 

Typical Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

 

High Tg Printed Circuit FR4 PCB Board With Immersion Gold 0

 

PCB Specifications

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 TU-872 SLK Sp FR-4 TU-872 SLK Sp ACC
Tg 170 170 ACC
Supplier TU TU ACC
Thickness 1.6±10% mm 1.61-1.62mm ACC
2.Plating thickness Hole Wall 25µm 26.51µm ACC
Outer copper 35µm 40.21µm ACC
Inner Copper 30µm 31.15µm ACC
3.Solder mask Material Type Kuangshun Kuangshun ACC
Color Green Green ACC
Rigidity (Pencil Test) 4H or above 5H ACC
S/M Thickness 10 µm 19.55µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S, S/S C/S, S/S ACC
5. Peelable Solder Mask Material Type      
Thickness      
Location      
6. Identification UL Mark YES YES ACC
Date Code WWYY 0421 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness      
Nickel Thickness 3-6µm 5.27µm ACC
Gold Thickness 0.05µm 0.065µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 7mil 6.8mil ACC
Min. Spacing (mil) 6mil 6.2mil ACC
10.V-groove Angle 30±5º 30º ACC
Residual thickness 0.4±0.1mm 0.38mm ACC
11. Beveling Angle      
Height      
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.32% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5 OK ACC
Thermal Stress Test 288 ±5 OK ACC
Ionic Contamination Test 1.56 µg/c 0.58µg/c ACC

 

High Tg PCB

The thermal properties of the resin system are characterized by the glass transition temperature (Tg), which always is expressed in °C. The most commonly used property is the thermal expansion. When measuring the expansion versus the temperature, we can get a curve as shown in following picture. The Tg is determined by the intersection of the tangents of the flat and steep parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and glassy. When the glass transition temperature is exceeded, it changes to a soft and rubbery state.

 

For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg. This implies a certain risk of wall cracking in plated-through holes, and the more resin around the hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between epoxy and copper is only three times, so here the risk of cracking is negligible.

 

The Tg of general board is above 130 celsius degrees, high Tg is generally greater than 170 celsius degrees, medium Tg is about greater than 150 celsius degrees.

PCB boards with Tg ≥ 170 ° C are usually called high Tg PCBs.

 

Partial High Tg Material in House

Material Tg () Manufacturer
S1000-2M 180 Shengyi
TU-768 170 TU
TU-872 SLK Sp 170 TU
TU-883 170 TU
IT-180ATC 175 ITEQ
KB-6167F 170 KB
M6 185 Panasonic
Kappa 438 280 Rogers
RO4350B 280 Rogers
RO4003C 280 Rogers
RO4730G3 280 Rogers
RO4360G2 280 Rogers

 

High Tg Printed Circuit FR4 PCB Board With Immersion Gold 1

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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