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Product Details:
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| Base Material: | FR-4 / Polyimide | Layer Count: | 6 Layers |
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| PCB Thickness: | 1.4mm | PCB Size: | 20.61 X 50.17mm |
| Coverlay: | Yellow Coverlay / Green Solder Mask | Silkscreen: | White |
| Copper Weight: | Inner 18um, Outer 35um | Surface Finish: | Immersion Gold |
| High Light: | Double Layer Flex Printed Circuit,70um Flex Printed Circuit |
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Rigid-Flex PCB Built on FR-4 and Poyimide With Immersion Gold and 90ohm Impedance Control
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of rigid-flex PCB for the application of car tracker GPS. It’s a 6-layer build-up with 1.4mm thick, half ounces on inner layers and 1 ounce on out layers. It is also an impedance controlled design on outer layers and inner flexible circuit. Immersion gold is plated on pads for latter SMT. The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.
Parameter and data sheet
| Size of Flexible PCB | 20.61 X 50.17mm |
| Number of Layers | 6 |
| Board Type | Rigid flex PCB |
| Board Thickness | 1.4mm |
| Board Material | FR-4 / Polyimide |
| Board Material Supplier | Shengyi |
| Tg Value of Board Material | 130℃ |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 18 µm |
| Surface Cu thickness | 35 µm |
| Coverlay Colour | Yellow coverlay / Green solder mask |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | N/A |
| Stiffener Thickness | N/A |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
The end can be whole soldered
Low cost
Continuity of processing
No minimum order quantity and low cost sample.
Make delivery on time. We keep higher than 98% on-time-delivery rate.
Applications
Contact belt of inkjet printer, industrial surveying and mapping instrument, Tablet PC camera soft board
Flexible Inner Layers
Inner layers are produced as single- or double-sided flexible circuits in the same way i.e., imaged, etched and covercoated, but not drilled and plated. Covercoating of the individual inner layer circuits requires an extra process, but the advantage is less risk of air entrapment.
The inner layers in the flexible section can also be bonded together . Although it is a simpler design that involves fewer process steps, the finished circuit has the disadvantage of being fairly rigid, and therefore difficult to bend. This is reflected in a rather limited number of bend cycles, e.g., maximum 25.
Another method is to avoid bonding of the flexible circuits in the flexible area. In the case of many inner layers, or when there is a short distance between the rigid sections of a flex/rigid circuit, a staggered build-up can be employed. This prevents buckling of the individual layers when the circuit is to be bent into its installed position, but the manufacture is somewhat more complicated.
Rigid Outer Layers
In the case of flex/rigid circuits, rigid materials such as FR-4 are cut to size, and bonded to the circuit in the lamination process. It is possible to produce the flex/rigid circuit as a temporarily rigid board to facilitate handling during manufacture, assembly and soldering. This is achieved by extending the rigid layers across the flexible section. By covering both sides of the flexible section with release films, bonding of the rigid outer layers to the flexible section is prevented. The non-bonded sections of the rigid material can be removed by a snap-action, provided grooves are cut before lamination at the interfaces in both sides of each rigid outer
layer.
Processes
A simplified flow diagram is shown below.
More Displays of rigid-flex PCB
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
