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Assembled Flexible Printed Circuit FPC Assembly

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Assembled Flexible Printed Circuit FPC Assembly

Assembled Flexible Printed Circuit FPC Assembly
Assembled Flexible Printed Circuit FPC Assembly Assembled Flexible Printed Circuit FPC Assembly Assembled Flexible Printed Circuit FPC Assembly Assembled Flexible Printed Circuit FPC Assembly Assembled Flexible Printed Circuit FPC Assembly Assembled Flexible Printed Circuit FPC Assembly Assembled Flexible Printed Circuit FPC Assembly

Large Image :  Assembled Flexible Printed Circuit FPC Assembly

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-261.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Polyimide Layer Count: 2 Layers
PCB Thickness: 0.2mm PCB Size: 120 X 95mm = 1 PCS
Coverlay: Yellow Silkscreen: N/A
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

Black Coverlay Polyimide Flexible PCB

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4 Layer Polyimide Flexible PCB

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4 Layer Polyimide Flex Circuit

 

Assembled Flexible Printed Circuit FPC Assembly

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of flexible printed circuits built on polyimide substrate with connectors assembled for the application of USB wireless. The base material is double layer adhesive RA Copper 35um on polyimide 25um thick. It has 100 Ohm differential impedance with 4.7mil track and 7.9mil track seperation. There're 2 thickness on the head stiffener, one for 0.3mm FR-4 and one for 0.8mm FR-4 to support the connectors. Whole flex has no silkscreen, but with yellow coverlay and immersion gold on pads. The base material is from Shengyi SF202, entire board supplying single up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Every 80 pieces are packed for shipment.

 

Parameter and data sheet

PCB Size: 120 x 95mm = 1 PCS
Number of Layers 2 layers
Board Type Flexbile cirucit
Board Thickness 0.2mm +/-10%
Board Material Double layer adhesive RA Copper 35um, Polyimide 25um
Board Material Supplier Shengyi
Tg Value of Board Material 60℃
 
PTH Cu thickness 20 um
Inner Iayer Cu thicknes N/A
Surface Cu thickness 35 um (1oz)
 
Coverlay Colour Yellow
Number of Coverlay 2
Thickness of Coverlay 25 um
Stiffener 0.3mm FR4+pure glue
0.8mm FR4+pure glue
 
Type of Silkscreen Ink N/A
Supplier of Silkscreen N/A
Color of Silkscreen N/A
Number of Silkscreen N/A
 
Minimum via (mm) 0.3
Minimum Trace (mil) 4.7
Minimum Gap(mil) 7.9
Impedance Control 100 Ohm differential impedance with 4.7mil track and 7.9mil strak seperation
 
Surface Finish Immersion Gold
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2
Type of artwork to be supplied email file, Gerber RS-274-X, PCBDOC etc
Service area Worldwide, Globally.

 

Assembled Flexible Printed Circuit FPC Assembly 0

 

Features and benefits

Excellent flexibility;

Reducing the volume;

Weight reduction;

High solderability, no stressing of circuit boards and less contamination of PCB surface;

Quick and on-time delivery;

16000 square meter workshop;

On-time service;

More than 19 years of PCB experience;

 

Applications

Industrial control temperature controller, Automobile sensor flex board, LED display, Tablet PC module, laser head FPC, mobile phone built-in antenna FPC, contact belt of inkjet printer

 

Components of a flexible circuit

A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

Copper foil is available in two different types of copper: ED Copper and RA copper.

 

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.

 

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

 

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.

 

More Assembled FPC

 

Assembled Flexible Printed Circuit FPC Assembly 1

 

Assembled Flexible Printed Circuit FPC Assembly 2

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)