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| Base Material: | Ceramic-filled PTFE Composite | Layer Count: | 2 Layer, Multilayer, Hybrid PCB |
|---|---|---|---|
| PCB Thickness: | 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm) | PCB Size: | ≤400mm X 500mm |
| Solder Mask: | Green, Black, Blue, Yellow, Red Etc. | Copper Weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface Finish: | Bare Copper, HASL, ENIG, OSP Etc. | ||
| High Light: | Rogers 3006 PCB Board,50mil Thick Coating PCB Board,Ceramic Filled Rogers PCB Board |
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Rogers RO3006 High Frequency PCB with 10mil, 25mil and 50mil Thick Coating Immersion Gold, Immersion Tin and Silver, OSP
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello everyone,
Today we’re talk about RO3006 high frequency PCBs.
RO3006 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.
More features and applications are as follows:
Firstly, excellent mechanical properties versus temperature, it’s reliable for stripline and multi-layer board constructions.
Secondly, uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.
Thirdly, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.
| PCB Capability | |
| PCB Material: | Ceramic-filled PTFE composite |
| Designation: | RO3006 |
| Dielectric constant: | 6.15 ±0.3 (process) |
| 6.5 (design) | |
| Layer count: | 2 Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 25mil (0.635mm) |
| 50mil (1.27mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
RO3006 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.3mm to 1.3mm thick, maximum size 400mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.
Typical applications are automotive radar applications, GPS antennas, Power amplifiers and antennas, patch antennas for wireless communicationS, direct broadcast satellite etc.
The basic colour of RO3006 PCB is white.
The manufacturing process of RO3006 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.
The basic colour of RO3006 PCB is white.
The manufacturing process of RO3006 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Data Sheet RO3006
| RO3006 Typical Value | |||||
| Property | RO3006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.27 0.15 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1498 1293 |
X Y |
MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.86 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) |
17 17 24 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
