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RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity

RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity
RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity

Large Image :  RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-027.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RF-35TC Layer Count: 2 Layers
PCB Size: 132 X 58mm=1PCS PCB Thickness: 1.6mm
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

35um Copper Dual Layer PCB

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132x58mm Dual Layer PCB

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Taconic Dual Layer PCB

 

Taconic High Frequency PCB Built on RF-35TC 60mil 1.524mm With Immersion Gold for Satellites

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.

 

RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.

 

This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.

 

The RF-35TC laminates are ideal for antennas, satellites, filters, couplers and power amplifiers.

 

PCB Specifications

PCB SIZE 132 x 58mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RF-35TC 1.524mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 7 mil / 7 mil
Minimum / Maximum Holes: N/A
Number of Different Holes: N/A
Number of Drill Holes: N/A
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RF-35TC 1.524mm
Final foil external: 1.5 oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold
Solder Mask Apply To: Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend Bottom
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity 0

 

Data Sheet of RF-35TC

RF-35TC TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.5.1(modified)   3.5   3.5
Tck(-30 to 120℃) IPC-650 2.5.5.5.1(modified) ppm 24 ppm 24
Df @10 GHz IPC-650 2.5.5.5.1(modified)   0.0011   0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19   0.18   0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19   0.23   0.18
Compressive Modulus ASTM D 695(23) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 11 ppm/ 11
CTE(Y axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 13 ppm/ 13
CTE(Z axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 34 ppm/ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D)   79.1   79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g) 0.94 j/(g) 0.94
Td(2% Weight Loss) IPC-650 2.4.24.6/TGA oF 788 420
Td(5% Weight Loss) IPC-650 2.4.24.6/TGA oF 817 436

 

RF-35TC 35um Copper 132x58mm Dual Layer PCB High Thermal Conductivity 1

 

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